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US 2009/0126977 A1Published application
Multilayer film
AssigneeHewlett-Packard Development Company, L.P.
InventorsPaval Kornilovich, Peter Mardilovich, Sriram Ramamoorthi
Life of this patent
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Abstract
This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film.
Claims10
1-21. (canceled)
A multilayer film having multiple nanometer-scale thickness conductive layers and multiple micrometer-or-larger-scale contact regions, each of the multiple micrometer-or-larger-scale contact regions enabling individual electrical communication with one of the multiple nanometer-scale-thickness conductive layers.
A multilayer film comprising:
- a plurality of conductive layers, each conductive layer having an exposed edge having a thickness between about one and about 100 nanometers;
- a plurality of insulative layers, each insulative layer having an exposed edge having a thickness between about one and about 500 nanometers, and
- a plurality of contact regions each contact region enabling individual electrical communication with one of the conductive layers and having an exposed area, each dimension of the exposed area being at least about an order of magnitude larger than the thickness of the exposed edge of the conductive layer with which the contact region enables electrical communication.
Dependencies are inferred from the claim text.