Method and apparatus for manufacturing relief material for seamless printing
AssigneeAsahi Kasei Chemicals Corporation
InventorsMiyoshi Watanabe, Tomohiro Kishida
Life of this patent
Estimating the term…
Abstract
A workpiece 70 is set to holding rotating means and then liquid-state photosensitive resin 10 is supplied to a resin applying smoothing unit 150 to mold the workpiece 70 into a uniform thickness while rotating the workpiece 70 and applying the liquid-state photosensitive resin 10 to the outer periphery of the workpiece 70 by the resin applying smoothing unit 150. Moreover, while rotating the workpiece 70, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet light 30 and thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beam 40 to perform post-treatment.
Claims26
A method for manufacturing a relief material for seamless printing using a liquid-state photosensitive resin, comprising:
- a setting step of setting a workpiece using either of a printing cylinder and a printing sleeve integrally supported by a metallic mandrel to holding rotating means for holding and rotating the workpiece;
- a supplying step of supplying a liquid-state photosensitive resin having a viscosity capable of holding an applying shape without being influenced by the gravity and centrifugal force due to rotation to a resin receiving plate which has a predetermined inclination and of which front end has a doctor blade shape by resin supplying means at a desired applied width in a linear mode;
- a molding step of molding the liquid-state photosensitive resin supplied to the resin receiving plate into a predetermined applied thickness by a front-end cutting edge of the resin receiving plate while rotating the workpiece and applying the resin to the outer periphery of the workpiece at a desired applied width;
- and
- an exposing step of forming a photosensitive resin cured layer by applying high-intensity ultraviolet light to the liquid-state photosensitive resin applied to the outer periphery of the workpiece while rotating the workpiece and thereby optically curing the liquid-state photosensitive resin so that it can be carved by an infrared laser beam.
An apparatus for manufacturing a relief material for seamless printing using a liquid-state photosensitive resin, comprising:
- a workpiece continuous rotating mechanism having a structure capable of rotating by integrally connecting a workpiece to whose outer periphery the liquid-state photosensitive resin is applied;
- a resin supplying mechanism according to any one of a first resin supplying mechanism having a resin supplying nozzle integrated with a vessel for housing the liquid-state photosensitive resin and capable of linearly moving in the axis center direction of the workpiece, and a second resin supplying mechanism having at least one or more resin supplying nozzles in accordance with a desired applied width on a resin supplying header pipe-connected with the vessel for housing the liquid-state photosensitive resin;
- a resin applying smoothing mechanism having a resin receiving plate whose front end has a doctor blade shape at a position facing the workpiece, having a structure which can linearly move in the direction vertical to the axis center of the workpiece and adjust a tilt angle;
- and
- an exposing mechanism capable of applying high-intensity ultraviolet light to liquid-state photosensitive resin applied to the outer periphery of the workpiece and smoothed and linearly moving the applying means in the direction vertical to the axis center of the workpiece.
Dependencies are inferred from the claim text.