Photosensitive resin composition and adhesion promoter
AssigneeToray Industries, Inc.
InventorsTomoyuki Yuba, Yoji Fujita, Masao Tomikawa
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Abstract
The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.
Claims7
A photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxyl group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator.
An adhesion promoter comprising at least one selected from compounds represented by the general formulas (1) to (3).
Dependencies are inferred from the claim text.