# US 2009/0120672 A1 · Method for manufacturing a laminate cover, laminate protective layer, and laminate electronic device having a reduced cost, manufacturing time, weight, and thickness > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2009/0120672 A1 - Document ID: US20090120672A1 - Status: Published application - Kind: A1 - Application number: 12/354,536 - Filed: 2009-01-15 - Published: 2009-05-14 - Earliest claimed: 2005-05-04 - Assignees: Nokia Corporation - Inventors: Ramin Vatanparast; Mikko Aarras; Steven O. Dunford; Takaharu Fujii; Juhani Lainonen; Jaakko Nousiainen; Jukka I. Rantala; Pia Tanskanen; Tetsuya Yamamoto - Web page: https://patentgrep.com/patent/US20090120672A1 ## CPC - H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors - H04M 1/0283: {for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate} - H04M 1/23: Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof (by improving visibility H04M1/22) - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H01H 2207/014: Plated through holes - H01H 2207/026: Pressure contact - H01H 2209/06: transparent - H01H 2221/002: integral with membrane - H01H 2229/004: Conductive ink - H01H 2229/022: Modular assembly - H01H 2229/028: Adhesive - H01H 2229/03: Laminating - H01H 2229/05: Forming; Half-punching - H01H 2239/01: combined with other elements on the same substrate - Y10T 29/49117: Conductor or circuit manufacturing - Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc. - Y10T 29/49126: Assembling bases - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49144: by metal fusion - Y10T 29/49165: by forming conductive walled aperture in base - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) - H01H: ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES (contact cables H01B7/10; electrolytic self-interrupters H01G9/18; emergency protective circuit arrangements H02H; switching by electronic means without contact-making H03K17/00) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the manufacturing methods provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location. ## Claims ### Claim 1 An apparatus comprising: a first support layer; at least one electronic component positioned on one side of the first support layer, the at least one electronic component including at least one conductive portion, the at least one conductive portion being adapted to communicate with an electronic device; an adhesive layer disposed on the side of the first support layer carrying the at least one electronic component; and a second support layer disposed on the adhesive layer so that the at least one electronic component is laminated between the first and second support layers to form a composite layer, the composite layer being adapted to operably engage the electronic device such that the at least one electronic component is capable of communicating with the electronic device via the at least one conductive portion wherein the first support layer defines at least one aperture, the at least one aperture configured to receive the at least one conductive portion of the at least one electronic component such that the at least one electronic component is recessed within the first support layer. ### Claim 2 (depends on 1) An apparatus according to claim 1 further comprising a plurality of conductive elements disposed on the side of the first support layer carrying the at least one electronic component. ### Claim 3 (depends on 2) An apparatus according to claim 2 wherein the conductive elements are disposed using a process selected from the group consisting of: conductive inkjet printing; polymer thick-layer printing; vacuum sputtering; laser direct imaging; direct metallizing; micro-deposition direct-write (MDDW); and combinations thereof. ### Claim 4 (depends on 1) An apparatus according to claim 1 wherein at least one conductive aperture is defined using a process selected from the group consisting of: laser drilling and metallizing; applying conductive ink plugs; and combinations thereof. ### Claim 5 (depends on 1) An apparatus according to claim 1 wherein the at least one electronic component is attached to the first support layer with adhesives, solders or combinations thereof. ### Claim 6 (depends on 1) An apparatus according to claim 1 wherein the second support layer is disposed using a process selected from the group consisting of: vacuum laminating; low-temperature laminating; and combinations thereof. ### Claim 7 (depends on 1) An apparatus according to claim 1 wherein the adhesive layer comprises a plurality of translucent pathways that are configured to communicate with the at least one electronic component and are also configured to transmit a light signal that is visually perceptible. ### Claim 8 (depends on 1) An apparatus according to claim 1 further comprising at least one flexible fiberoptic element disposed on one side of the first support layer, the at least one flexible fiberoptic element configured to communicate with the at least one electronic component and also configured to transmit a light signal that is visually perceptible. ### Claim 9 (depends on 1) An apparatus according to claim 1 further comprising at least one flexible actuation member in the second support layer, wherein the at least one flexible actuation member is positioned relative to the first support layer such that the at least one flexible actuation member is configured to selectively contact the respective conductive element upon being actuated. ### Claim 10 (depends on 1) An apparatus according to claim 1, wherein the first and second support layers comprise substantially flexible materials.