Amidoxime compounds as chelating agents in semiconductor processes
OwnerWai Mun Lee, Mark A. Scialdone +1inventors
InventorsWai Mun Lee, Mark A. Scialdone, Albert G. Anderson
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Abstract
The present invention is a composition and cleaning method for use in semiconductor processes wherein the compositions comprises at least one amidoxime compound.
Claims34
A cleaning composition comprising water and at least one amidoxime compound.
A method of applying a composition comprising water and an amidoxime compound to a semiconductor substrate, comprising contacting the substrate with the composition.
A process for preparing a semiconductor surface comprising:
- a. forming an aqueous mixture of a cyanoethylation catalyst and a nucleophile containing an alcohol or amine functionality;
- b. adding an unsaturated nitrile to the mixture of step (a) and allowing the unsaturated nitrile to react with the alcohol or amine functionality to form a first aqueous solution;
- c. adding a source of hydroxylamine to the first aqueous solution of step (b) to form a second solution;
- and
- d. applying the second solution to a semiconductor surface containing copper.
A method of processing a wafer comprising
- placing a wafer in a single wafer or batch cleaning tool and exposing the wafer to a cleaning solution comprising at least one amidoxime compound, wherein the wafer is exposed to the solution at a sufficient time and temperature to effectively remove surface residue and contaminants created during a semiconductor manufacturing process.
A method of cleaning a wafer comprising:
- placing a wafer in a cleaning tool;
- and cleaning the wafer with a solution comprising;
- water, an amidoxime compound;
- an organic solvent in an amount up to about 99 percent by weight;
- optionally a base in an amount of about 1 to about 45 percent by weight;
- optionally a compound with an oxidation and reduction potential in an amount of about 0.001 to about 25 percent by weight;
- optionally an activator in an amount of about 0.001 to about 25 percent by weight;
- an additional chelating or complexing agent in an amount up to about 15 percent by weight;
- optionally a surfactant in an amount of about 10 ppm to about 5 percent by weight;
- and optionally a fluoride ion source in an amount of about 0.001 to about 10 percent by weight.
A method of cleaning a wafer comprising:
- placing a wafer in a cleaning tool;
- and cleaning the wafer with a solution comprising;
- water, an amidoxime compound;
- an organic solvent in an amount up to about 99 percent by weight;
- optionally an acid in an amount of about 0.001 to about 15 percent by weight;
- optionally a compound with oxidation and reduction potential in an amount of about 0.001 to about 25 percent by weight;
- optionally an activator in an amount of about 0.001 to about 25 percent by weight;
- an additional chelating or complexing agent in an amount up to about 15 percent by weight;
- optionally a surfactant in an amount of about 10 ppm to about 5 percent by weight;
- and optionally a fluoride ion source in an amount of about 0.001 to about 10 percent by weight.
Dependencies are inferred from the claim text.