Underfill formulation and method of increasing an adhesion property of same
AssigneeIntel Corporation
InventorsLinda A. Shekhawat, Gregory S. Constable, Youzhi E. Xu, Nisha Ananthakrishan
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Abstract
An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
Claims20
An underfill formulation comprising:
- a solvent;
- a plurality of amphiphilic block copolymers in the solvent;
- and
- an adhesion promoter in the solvent,
- wherein:
- groups of the plurality of amphiphilic block copolymers form a plurality of micelles in the solvent, the micelles comprising a core and a shell surrounding the core;
- and
- the adhesion promoter is in the core of at least some of the plurality of micelles.
An underfill formulation comprising:
- an epoxy resin;
- a plurality of amphiphilic block copolymers, each one of which comprises a first block segment that is insoluble in the epoxy resin and a second block segment that is soluble in the epoxy resin;
- and
- a polar reagent.
A method of increasing an adhesion property of an underfill formulation, the method comprising:
- providing a nonpolar solvent;
- adding a plurality of amphiphilic block copolymers to the nonpolar solvent such that a plurality of micelles are formed in the nonpolar solvent, each micelle in the plurality of micelles having a core and a shell surrounding the core;
- and
- adding a polar adhesion promoter to the nonpolar solvent such that the polar adhesion promoter migrates to the cores of at least some of the plurality of micelles.
Dependencies are inferred from the claim text.