Aligner
AssigneeKabushiki Kaisha Yaskawa Denki
InventorsKeisuke Yoshino, Mitsuaki Hagio, Shin Osaki, Yoshihiro Kusama
Life of this patent
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Abstract
It is an object to provide an aligner for centering a wafer and adjusting an angle of a notch or the like of the wafer while gripping edges of the wafer capable of attaining a shortened takt time and miniaturization of the apparatus by employing a mechanism capable of infinite rotation without being restricted by a rotational range, by eliminating cables and/or tubes at the rotating portion. The link mechanism for causing opening and closing movements of the gripping mechanism for gripping a wafer 1 is supported via a bearing 14 with respect to the link mechanism driving portion for driving the link mechanism so that only the gripping portion and the link mechanism can be rotated.
Claims9
A wafer aligner comprising a gripping mechanism for gripping an external periphery of a wafer by an open and close operation, a rotating mechanism for rotating the gripping mechanism gripping the wafer, and a detection sensor mechanism for detecting a cut-out and the external periphery of the wafer, the wafer aligner further comprises:
- a link mechanism for causing horizontal opening and closing movements of the gripping mechanism;
- and
- a link mechanism driving portion for driving the link mechanism,
- wherein the link mechanism driving portion rotatably supports the link mechanism on a wafer rotating shaft.
Dependencies are inferred from the claim text.