Contact spring assembly for electronic devices
AssigneeChi Mei Communication Systems, Inc.
InventorCHENG-LUNG CHANG
Life of this patent
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Abstract
A contact spring assembly (30) for an electronic device includes a mounting portion (31), a press spring (32), and a deformable spring (37). The press spring and the deformable spring are respectively bent from the mounting portion. The press spring resists the deformable spring. The press spring is configured to be moved along a first direction and push the deformable spring to move along a second direction different from the first direction.
Claims15
A contact spring assembly for an electronic device, comprising:
- a mounting portion configured to be mounted on the electronic device;
- a resiliently depressible press spring bent from the mounting portion;
- and
- a deformable spring bent from the mounting portion;
- wherein the press spring resiliently depressibly resists the deformable spring, the press spring being configured to be moved along a first direction thereby pushing the deformable spring to move along a second direction different from the first direction.
The contact spring being bent from one of the two opposite ends of the mounting portion, the deformable spring being bent from the other one of the two opposite ends of the mounting portion.
Dependencies are inferred from the claim text.