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AssigneeDu Pont-Mitsui Polychemicals Co., Ltd.
InventorsKoichi Nishijima, Manabu Kawamoto, Rie Sato, Tetsuya Nakamura
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The present invention provides a process for producing an encapsulating material for solar cell which makes high-speed crosslinking possible and causes no blister phenomenon without significant restrictions being imposed on the conditions for molding the encapsulating material. The present invention provides a process for producing the encapsulating material for solar cell including impregnating a molded form of an ethylene copolymer with an organic peroxide in a liquid state at normal temperature which shows a decomposition temperature (a temperature at which the half-life period is one hour) of not higher than 150° C. A process for producing the encapsulating material for solar cell in which dialkyl peroxide (A) and an organic peroxide (B) selected from peroxycarbonate and peroxyketal at a ratio by weight of 10/90 to 90/10 of (A) and (B) in a liquid state impregnate the molded form of the ethylene copolymer is a preferable embodiment of the present invention.
A process for producing an encapsulating material for solar cell, including impregnating a molded form of an ethylene copolymer with an organic peroxide in a liquid state at normal temperature which shows a decomposition temperature (a temperature at which the half-life period is one hour) of not higher than 150° C.
Dependencies are inferred from the claim text.