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US 2009/0023858 A1Published application
Scree-printable encapsulants based on polyhydroxyamides that thermally convert to polybenzoxazoles
AssigneeCDA Processing Limited Liability Company
InventorsJOHN D. SUMMERS, THOMAS EUGENE DUEBER
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Abstract
This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Claims18
A screen printable encapsulant composition for coating an electronic component comprising
- at least one polyhydroxyamide that forms polybenzoxazole on heating;
- and
- an organic solvent,
- wherein the polyhydroxyamide is soluble in a screen printing solvent.
1 more element
A method of encapsulating a fired-on-foil ceramic capacitor with a polybenzoxazole encapsulant, comprising
- providing a composition of a polyhydroxyamide dissolved in an organic solvent,
- screen printing the composition on a fired-on-foil capacitor,
- heating the composition to cure the composition and form polybenzoxazole encapsulant on the capacitor.
Dependencies are inferred from the claim text.