Process for producing pressure-sensitive adhesive layer
AssigneeNitto Denko Corporation
InventorsKazuhisa Maeda, Isao Hirose, Kunio Nagasaki
Life of this patent
Estimating the term…
Loading patent…
AssigneeNitto Denko Corporation
InventorsKazuhisa Maeda, Isao Hirose, Kunio Nagasaki
Estimating the term…
The present invention relates to a process for producing a pressure-sensitive adhesive layer, which includes irradiating a photopolymerizable acrylic pressure-sensitive adhesive composition layer provided between two films with an active energy beam to polymerize the photopolymerizable acrylic pressure-sensitive adhesive composition layer, in which the polymerization is performed while a layer of a composition for preventing polymerization inhibition which is curable with an active energy beam in the atmosphere is provided on a side surface of the photopolymerizable acrylic pressure-sensitive adhesive composition layer. According to the process for producing a pressure-sensitive adhesive layer of the present invention, owing to the construction as discussed above, it is possible to reuse a film. Moreover, it is possible to prevent a lowering in the cohesive force in the side surface of the thus formed pressure-sensitive adhesive composition layer caused by a lowering in the polymerization degree in the side surface of the photopolymerizable acrylic pressure-sensitive adhesive composition layer during the photopolymerization.
A process for producing a pressure-sensitive adhesive layer, which comprises:
Dependencies are inferred from the claim text.