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US 2009/0023364 A1Published application
Method of making a wafer having an asymmetric edge profile
OwnerChih-Ping Kuoinventor
Life of this patent
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Abstract
A wafer having an asymmetric edge profile is provided. The wafer has a disk-like body. The disc-like body has a first main surface, a second main surface parallel to the first main surface, and an edge region. The disk-like body has a central line defined between the first main surface and the second main surface, the edge region has an edge profile, and the edge profile is asymmetric with respect to the central line of the first main surface and the second main surface.
Claims4
A method of fabricating a wafer having an asymmetric edge profile comprising:
- providing a wafer, the wafer comprising a first main surface, a second main surface parallel to the first main surface, and an edge region perpendicular to the first main surface and the second main surface, wherein the first main surface and the second main surface define a central line between them;
- polishing the edge region of the wafer, so that the edge region has an edge profile asymmetric with respect to the central line of the first main surface and the second main surface;
- thinning the wafer from the second main surface until the wafer reaches a predetermined thickness, an included angle between a tangential line to any point on the edge profile and the first main surface or the second main surface being an obtuse angle according to the predetermined thickness.
Dependencies are inferred from the claim text.