Integrated Wafer Processing System for Integration of Patternable Dielectric Materials
AssigneeIBM Corporation (Yorktown)
InventorsQinghuang Lin, Sampath Purushothaman, Robert Wisnieff
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Abstract
The present disclosure relates to an integrated wafer processing apparatus for fabricating semiconductor chips. This integrated wafer processing system combines the lithography patterning steps and irradiation curing steps of the patternable dielectric into one system. The patternable low-k material of the present disclosure also functions as a photoresist, i.e. is a photo-patternable low-k dielectric material.
Claims20
An integrated circuit manufacturing apparatus for forming damascene interconnects of patternable low-k material on a wafer comprising:
- at least one module for deposition of patternable low-k material on a semiconductor wafer;
- at least one module for uniformly heating the wafers;
- at least one module for pattern-wise exposure of the patternable low-k material on the semiconductor wafer;
- at least one module for developing the exposed wafer to form relief images;
- and
- at least one module for curing the relief images to form damascene structure as an integrated circuit interconnect;
- wherein all modules are integrated into a single housing.
A method for forming damascene interconnects of patternable low-k material on a wafer comprising:
- depositing a patternable low-k material on a semiconductor wafer;
- uniformly heating the wafers;
- pattern-wise exposing the patternable low-k material on the semiconductor wafer;
- developing the exposed wafer to form relief image;
- and
- curing the relief images to form damascene structure as an integrated circuit interconnect;
- wherein, all these steps are performed in a single housing.
The method of cliam 17 wherein the wavelength of the UV light is from about 50 nm to about 300 nm and the light source for the ultra-violet (UV) cure is a UV lamp, an excimer laser or a combination thereof.
The method of 18 wherein light of the ultra-violet (UV) cure is enhanced and/or diffused with a lens, mirrors, optical diffusing elements, or combinations thereof.
Dependencies are inferred from the claim text.