Method of packaging a semiconductor die
AssigneeFreescale Semiconductor, Inc.
InventorsDavid F. Abdo, Alexander J. Elliott, Lakshminarayan Viswanathan
Life of this patent
Estimating the term…
Abstract
A method of packaging a semiconductor die includes the steps of providing a flange (110), coupling one or more active die (341) to the flange with a lead-free die attach material (350), staking a leadframe (120) to the flange after coupling the one or more active die to the flange, electrically interconnecting the one or more active die and the leadframe with an interconnect structure (470), and applying a plastic material (130) over the flange, the one or more active die, the leadframe, and the interconnect structure.
Claims20
A method of packaging a semiconductor die comprising the steps of:
- providing a flange;
- coupling one or more active die to the flange with a lead-free die attach material;
- after coupling the one or more active die to the flange, staking a leadframe to the flange;
- electrically interconnecting the one or more active die and the leadframe with an interconnect structure;
- and
- applying a plastic material over the flange, the one or more active die, the leadframe, and the interconnect structure.
A method of packaging a high power and high frequency semiconductor die comprising the steps of:
- providing a heatsink;
- providing at least two semiconductor die, wherein at least a first one of the at least two semiconductor die has at least one high power, active device and wherein at least a second one of the at least two semiconductor die has at least one passive device;
- using a lead-free, gold silicon die attach to couple the at least two semiconductor die to the heatsink;
- after the step of using a gold silicon die attach, mechanically staking a leadframe and the heatsink together;
- using wire bonds to electrically interconnect the at least two semiconductor die to the leadframe;
- overmolding a plastic material over the at least two semiconductor die, the gold silicon die attach, the wire bonds, and at least a portion of the leadframe;
- and
- singulating leads of the leadframe.
A semiconductor component comprising:
- a flange;
- two or more active die coupled to the flange with a lead-free die attach material;
- a leadframe and the flange staked together;
- an interconnect structure electrically coupling together the two or more active die and the leadframe;
- and
- a plastic packaging material over the flange, the two or more active die, the leadframe, and the interconnect structure.
Dependencies are inferred from the claim text.