Etching/bonding chamber for encapsulated devices and method of use
AssigneeInnovative Micro Technology
InventorsJohn S. Foster, Jeffrey F. Summers
Life of this patent
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Abstract
A method for activating a getter at low temperature for encapsulation in a device cavity containing a microdevice comprises etching a passivation layer off the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma etching process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then etches the passivation layer from the getter material, which is directly thereafter sealed within the device cavity of the microdevice, all within the etching/bonding chamber.
Claims23
A method for forming an encapsulated device, comprising:
- removing an outer layer from a getter material formed on one of two wafers, wherein the gettering surface absorbs impurity gases;
- and
- bonding the two wafers together to encapsulate a device formed on one of the wafers and the getter material in a device cavity defined by the two wafers.
An encapsulated device, comprising:
- a surface in a device cavity defined by a two wafers, wherein said surface includes a getter material which absorbs impurity gases;
- a microdevice enclosed in the device cavity;
- and
- a adhesive between the two wafers, wherein the adhesive forms a substantially hermetic bond at a temperature substantially less than 450 degrees centigrade.
An apparatus for forming an encapsulated device, comprising:
- means for removing an outer layer from a getter material formed on one of two wafers, wherein the getter material absorbs impurity gases;
- and
- means for bonding the two wafers to encapsulate a device formed on one of the wafers and the getter material in a device cavity defined by the two wafers, wherein the means for removing and the means for bonding are located within a single substantially sealed chamber.
Dependencies are inferred from the claim text.