Copper alloy
AssigneeNippon Mining & Metals Co., Ltd.
InventorsYasutaka Sugawara, Kazuhiko Fukamachi
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Abstract
Copper alloys having excellent strength while suppressing irregularity of wavelengths, etc., of the fluctuations and having excellent bendability are obtained while suppressing growth of crystal grains. The copper-based alloy contains 2.0 to 4.0 mass % of Ti, and the total content of unavoidable impurity elements Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag is not more than 0.1 mass %, and contents of each element thereof is not more than 0.01 mass %, and not less than 80% of quality of a second-phase particles having an area of not less than 0.01 μm2 observed by a cross section speculum contains not less than 3% of the total amount of the above described unavoidable impurity elements in composition.
Claims3
A copper alloy comprising:
- 2.0 to 4.0 mass % of Ti;
- not more than 0.1 mass % in total of unavoidable impurity elements consisting of Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag, each unavoidable impurity element being contained at not more than 0.01 mass %;
- and
- second-phase particles represented by Cu—Ti—X system particles, wherein X is selected from the group consisting of Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag;
- wherein the second-phase particles have an area of not less than 0.01 μm2 observed by a cross section speculum, and not less than 80% of the number of the second-phase particles contain not less than 3% in total amount of the unavoidable impurity elements in composition.
Dependencies are inferred from the claim text.