Adhesive Film
OwnerMasami Yanagida, Kenji Ueshimainventors
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Abstract
An adhesive film, having lubricity, which can be favorably used as an FPC board even when a dense circuit pattern is formed is provided. The adhesive film is obtained by providing a highly heat-resistant polyimide layer and thermoplastic polyimide layers on both surfaces of the highly heat-resistant polyimide layer. The highly heat-resistant polyimide layer, serving as a central layer, has substantially no lubricant existing therein. Each of the thermoplastic polyimide layers has a lubricant, uniformly dispersed in the thermoplastic polyimide layer, which has a median average particle diameter of 1 μm to 10 μm. The lubricant existing in the thermoplastic polyimide layer is covered with a thermoplastic polyimide resin.
Claims4
An adhesive film comprising:
- a highly heat-resistant polyimide layer which contains a non-thermoplastic polyimide and/or a precursor thereof, and
- thermoplastic polyimide layers, formed on both surfaces of the highly heat-resistant polyimide layer, each of which contains a thermoplastic polyimide and/or a precursor thereof,
- each of the thermoplastic polyimide layers having a thickness of 1.7 μm to 7.0 μm,
- the thermoplastic polyimide layer having a lubricant dispersed therein or the thermoplastic polyimide layer and the highly heat-resistant polyimide layer having the lubricant dispersed so as to straddle therebetween, the lubricant having a median average particle diameter of 1 μm to 10 μm,
- the highly heat-resistant polyimide layer having substantially no center point of the lubricant,
- the thermoplastic polyimide layer having a surface on which the lubricant form projections covered with a thermoplastic polyimide resin.
Dependencies are inferred from the claim text.