Method and mask assembly for forming solder bodies on a substrate
AssigneeUniversal Scientific Industrial Co., Ltd.
InventorsChi-Hsiung Cheng, Wan-Chen Chan, Hsun-Fa Li
Life of this patent
Estimating the term…
Abstract
A method for forming solder bodies on a substrate includes: positioning a first mask plate, which is formed with at least one first through-hole, on the substrate; filling the first through-hole with a first solder paste so as to form a first solder body on the substrate; positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess; and filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.
Claims4
A method for forming solder bodies on a substrate, comprising:
- positioning a first mask plate, which is formed with at least one first through-hole, on the substrate;
- filling the first through-hole with a first solder paste so as to form a first solder body on the substrate;
- positioning a second mask plate, which is formed with at least one second through-hole and at least one recess spaced apart from the second through-hole, on the substrate in such a manner that the first solder body is received in the recess;
- and
- filling the second through-hole with a second solder paste so as to form a second solder body on the substrate.
A mask assembly for forming solder bodies on first and second solder-forming regions of a substrate, comprising:
- a first mask plate formed with at least one first through-hole that is adapted to be aligned with the first solder-forming region of the substrate when said first mask plate is stacked on the substrate;
- and
- a second mask plate formed with at least one second through-hole that is adapted to be aligned with the second solder-forming region of the substrate when said second mask plate is stacked on the substrate, and a recess that is spaced apart from said second through-hole, that is adapted to be aligned with the first solder-forming region of the substrate when said second mask plate is stacked on the substrate, and that has a size greater than that of said first through-hole.
Dependencies are inferred from the claim text.