Package structure of compound semiconductor device and fabricating method thereof

A package method of a compound semiconductor device, comprising the steps of:

• providing a thin substrate including a first electrode and a second electrode;
• mounting a semiconductor die on the thin film substrate whereby a positive electrode of the semiconductor die is connected to a first electrode and a negative electrode of the semiconductor die is connected to the second electrode;
• and
• overlaying a transparent encapsulation material on the semiconductor die.

A package structure of a compound semiconductor device, comprising:

• a conductive film with a pattern including a first surface and a second surface, wherein the first surface is opposite to the second surface;
• a die mounted on the first surface of the conductive film;
• and
• a transparent encapsulation material overlaid on the first surface of the conductive film and the die.

A package method of a compound semiconductor device, comprising the steps of:

• providing a temporary substrate;
• forming a conductive film with a pattern on the temporary substrate, wherein the conductive film has a first surface and a second surface opposite the first surface;
• mounting a die to the first surface of the conductive film;
• overlaying a transparent encapsulation material on the first surface of the conductive film and the die;
• and
• removing the temporary substrate.

A package structure of a compound semiconductor device, comprising:

• a thin film substrate comprising an upper conductive film, an insulation film including a plurality of openings, and a lower conductive film, wherein the insulation film is sandwiched between the upper conductive film and lower conductive film;
• a die mounted on the upper conductive film;
• and
• an encapsulation material overlaid on the upper conductive film and the die.

A package method of a compound semiconductor device, comprising the steps of:

• providing an insulation film including a plurality of openings;
• forming an upper conductive film and a lower conductive film respectively on two surfaces of the insulation film, wherein the upper conductive film and the lower conductive film contact each other through the plurality of openings;
• mounting a die on the upper conductive film;
• and
• overlaying a transparent encapsulation material on the upper conductive film and the die.

A manufacturing method of a thin film substrate used in a light emitting diode, comprising the steps of:

• providing a temporary substrate;
• forming a conductive film with a pattern on the temporary substrate, wherein the conductive film comprises a first surface and a second surface opposite to the first surface;
• and
• removing the temporary substrate after a package of a light emitting diode is completed.