Light source, backlight module using the same, and method for manufacturing the same
AssigneeInnolux Display Corp.
InventorsYen-Chang Yao, Hsiang-Hui Hsieh
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Abstract
A light source includes a substrate, a plurality of blocks, and a plurality of light emitting diodes (LEDs). The blocks are disposed on the substrate and spaced from each other. Each LED includes a first electrode, a second electrode, a chip, and a bonding wire. The first and second electrodes are arranged on the substrate between every two blocks, and are electrically connected each other via the chip and the bonding wire. A related method for manufacturing the light source is also provided.
Claims19
A light source, comprising:
- a substrate;
- a plurality of blocks disposed on the substrate, the blocks being spaced from each other;
- and
- a plurality of light emitting diodes (LEDs), each comprising a first electrode, a second electrode, a chip, and a bonding wire, the first and second electrodes being arranged on the substrate and between two adjacent blocks, and electrically connected via the chip and the bonding wire.
A method for manufacturing a light source, the method comprising:
- providing a substrate, arranging a plurality of pairs of first and corresponding second electrodes thereon;
- b. forming a plurality of blocks on the substrate, the blocks separating pairs of electrodes so that at least one pair of the first and the second electrodes are located between two blocks;
- and
- c. encapsulating a chip at one electrode of each pair of electrodes, connecting the chip to the other electrode of the pair of electrodes via a bonding wire.
A backlight module, comprising a light source,
- the light source comprising:
- a substrate;
- a plurality of blocks disposed on the substrate, the blocks spaced from each other;
- and
- a plurality of light emitting diodes (LEDs), each comprising a first electrode, a second electrode, a chip, and a bonding wire, the first and second electrodes arranged on the substrate between two blocks, and electrically connected each other via the chip and the bonding wire.
Dependencies are inferred from the claim text.