Housing for a power module
AssigneeSemikron Elektronik GmbH & Co. KG
InventorsRainer Popp, Marco Lederer
Life of this patent
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Abstract
A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The power module has at least one module board element and a housing formed with shafts for the pressure contact elements. The shafts open out from the housing base facing printed circuit board at opening orifices. The base is formed with orifice sealing ribs around the opening orifices. Moreover, the base of the housing may have a peripheral edge sealing rib along its outer edge. Furthermore, a sealing area element can be provided between the printed circuit board and the base of the housing.
Claims10
A housing for a power module used as part of a circuit arrangement of the power module, a heat sink, a printed circuit board and a pressing device;
- wherein the power module and the printed circuit board are disposed between the heat sink and the pressing device and are pressure-contact-connected to one another by at least one pressure contact element;
- wherein the power module has at least one module board element;
- and
- wherein the housing comprises:
- a base that faces the printed circuit board;
- and
- at least one shaft having an opening orifice for receiving a pressure contact element, which pressure contact element is pressure-contact-connected to the at least one module board element and the printed circuit board, said shaft opening out from said base at said opening orifice;
- wherein said base includes at least one orifice sealing rib disposed about said opening orifice.
Dependencies are inferred from the claim text.