Semiconductor assembly having a housing

A power semiconductor module comprising:

• an electrically insulating substrate;
• at least one power semiconductor component arranged on the electrically insulating substrate;
• a housing comprising an inner housing comprising a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim, the pressure element being resiliently coupled to the inner housing;
• a pressure plate being arranged on the printed circuit board at least in regions directly above the pressure element, and
• fastening means for exerting pressure on the pressure element so as to attach the housing and the electrically insulating substrate to a surface.

A method comprising:

• providing an electrically insulating substrate comprising an electrically insulating body having a first primary surface and a second primary surface, and at least one power semiconductor component mounted on the first primary surface;
• providing a housing comprising an inner housing comprising a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim, the pressure element being resiliently coupled to the inner housing;
• arranging the housing such that the lower surface of the peripheral rim of the inner housing is arranged in contact with the first primary surface of the electrically insulating substrate and the at least one pressure element is arranged adjacent a side-face of the electrically insulating substrate and spaced at a distance from a surface to which the housing and electrically insulating substrate is to be attached;
• and
• applying pressure to the upper surface of the pressure element of the housing such that the lower surface of the pressure element comes into contact with the surface and such that pressure is exerted on the peripheral rim of the inner housing as a result of the resilient coupling between the pressure element and the inner housing so as to attach the housing and the second primary surface of the electrically insulating substrate to the surface.

A method comprising:

• providing an electrically insulating substrate comprising an electrically insulating body having a first primary surface and a second primary surface, and at least one power semiconductor component mounted on the first primary surface, a plurality of pins each having a pressure contact region extending generally perpendicularly from the first primary surface of the electrically insulating substrate;
• providing a housing comprising an inner housing comprising a cover and a peripheral rim, and at least one pressure element arranged adjacent a side-face of the peripheral rim, the pressure element being resiliently coupled to the inner housing;
• arranging the housing such that the lower surface of the peripheral rim of the inner housing is arranged in contact with the first primary surface of the electrically insulating substrate and the at least one pressure element is arranged adjacent a side-face of the electrically insulating substrate and spaced at a distance from a surface to which the housing and electrically insulating substrate is to be attached;
• arranging a printed circuit board on an upper surface of the pressure element so that a force fitted contact pin is arranged in each of the through-holes and to effect a force fitted contact to the printed circuit board and the contact pin;
• and
• applying pressure to the upper surface of the pressure element of the housing such that the lower surface of the pressure element comes into contact with the surface and such that pressure is exerted on the peripheral rim of the inner housing as a result of the resilient coupling between the pressure element and the inner housing so as to attach the housing and the second primary surface of the electrically insulating substrate to the surface.