Air guide with heat pipe and heat sink and electronic apparatus equipped with the same
AssigneeAdlink Technology Inc.
InventorsChih-Liang Fang, Yie-Tun Huang
Life of this patent
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Abstract
The invention discloses an air guide with at least one heat sink and at least one heat pipe. The heat pipe of the air guide can conduct the heat generated by a heat source to the heat sink of the air guide. The heat sink of the air guide increases the area of heat dissipation, and the distribution of the heat sink enables more blown-in air to carry the heat away. Accordingly, the air guide of the invention can increase the efficiency of heat dissipation within an electronic device.
Claims8
An air guide covering a main board, the main board comprising a heat source, the air guide comprising:
- a cover with a surface;
- at least one heat sink, disposed on the surface of the cover, being as distant from the heat source as possible;
- and
- at least one heat pipe, disposed on the surface of the cover, each of the at least one heat pipe has a first end and a second end, the first end being close to the heat source, the second end being close to one of the at least one heat sink, thereby the at least one heat pipe guides the heat generated by the heat source to the at least one heat sink.
An electronic apparatus, comprising:
- a main board comprising a heat source;
- and
- an air guide covering the main board, comprising:
- a cover with a surface;
- at least one first heat sink, disposed on the surface of the cover, being as distant from the heat source as possible;
- and
- at least one heat pipe, disposed on the surface of the cover, each of the at least one heat pipe with a first end and a second end, the first end being close to the heat source, the second end being close to one of the at least one first heat sink, thereby the at least one heat pipe guides the heat generated by the heat source to the at least one first heat sink.
Dependencies are inferred from the claim text.