Conductive polymer solution, conductive coating, condenser and process for manufacturing condenser

A condenser, comprising an anode composed of a valve metal, a dielectric layer formed by oxidation of a surface of said anode, and a solid electrolyte layer formed on a surface of said dielectric layer, wherein

• said solid electrolyte layer comprises a π-conjugated conductive polymer, a polyanion, a conductivity improver, and a silane coupling agent.

A condenser, comprising an anode composed of a valve metal, a dielectric layer formed by oxidation of a surface of said anode, and a solid electrolyte layer that is formed on an opposite side of said dielectric layer from said anode, wherein

• said solid electrolyte layer comprises a 1-conjugated conductive polymer, and
• an intermediate layer comprising a low-thermal expansion polymer having an average coefficient of thermal expansion within a range from 30 to 120° C. of not more than 300 ppm/° C. is provided between said dielectric layer and said solid electrolyte layer.

A process for manufacturing a condenser, comprising:

• adhering a conductive polymer solution comprising a π-conjugated conductive polymer, a polyanion, an amide compound and a solvent to a surface of a dielectric layer formed by oxidizing a surface of an anode composed of a valve metal, and
• drying said conductive polymer solution adhered to said surface of said dielectric layer.

A process for manufacturing a condenser, comprising:

• adhering a conductive polymer solution comprising a 1-conjugated conductive polymer, a polyanion, a conductivity improver, a silane coupling agent and a solvent to a surface of a dielectric layer formed by oxidizing a surface of an anode composed of a valve metal, and
• drying said conductive polymer solution adhered to said surface of said dielectric layer.

A process for manufacturing a condenser, comprising:

• applying a low-thermal expansion polymer solution, which is prepared by dissolving, in a solvent, a low-thermal expansion polymer having an average coefficient of thermal expansion within a range from 30 to 120° C. of not more than 300 ppm/° C., to a surface of a dielectric layer formed by oxidizing a surface of an anode composed of a valve metal, thereby forming an intermediate layer, and
• applying a conductive polymer solution, prepared by dissolving π-conjugated conductive polymer and a polyanion in a solvent, to a surface of said intermediate layer, thereby forming a solid electrolyte layer.

A conductive polymer solution, comprising a π-conjugated conductive polymer, a polyanion, a conductivity improver, an alkaline compound and a solvent.