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US 2009/0021024 A1Published application
Retaining Ring with Shaped Profile
AssigneeApplied Materials, Inc.
InventorsGopalakrishna B. Prabhu, Yin Yuan, Jeonghoon Oh, Gregory E. Menk
Life of this patent
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Abstract
Retaining rings with curved surfaces are described. The curved surfaces prevent damage to a fixed abrasive polishing pad when the retaining ring is used in a polishing process. The curved surfaces are on the bottom surface of the ring, such as along the outer diameter and/or along the sidewalls of channels formed in the bottom of the ring.
Claims19
A retaining ring for chemical mechanical polishing, comprising:
- an annular ring having a bottom surface configured to contact a polishing pad during polishing, wherein the bottom surface has a plurality of channels, each channel defined by sidewalls, at least one corner between at least one of the sidewalls and the bottom surface has a first radius of curvature and a corner between an outer diameter of the annular ring and the bottom surface has a second radius of curvature.
A retaining ring for chemical mechanical polishing, comprising:
- an annular ring having a bottom surface configured to contact a polishing pad during polishing, wherein the bottom surface has a plurality of channels, each channel defined by sidewalls, and a corner between one of the sidewalls and the bottom surface is chamfered.
A system for chemical mechanical polishing, comprising:
- a carrier head;
- a retaining ring attached to the carrier head, wherein the retaining ring comprises an annual portion having a bottom surface configured to contact a polishing pad during polishing, wherein the bottom surface has a plurality of channels, each channel defined by sidewalls, at least one corner between at least one of the sidewalls and the bottom surface has a first radius of curvature and a corner between an outer diameter of the annular ring and the bottom surface has a second radius of curvature;
- and
- a platen configured to support the polishing pad and retaining ring during polishing.
1 more element
A system for chemical mechanical polishing, comprising:
- a carrier head;
- a retaining ring attached to the carrier head, wherein the retaining ring comprises an annual portion having a bottom surface configured to contact a polishing pad during polishing, wherein the bottom surface has a plurality of channels, each channel defined by sidewalls, and a corner between one of the sidewalls and the bottom surface is chamfered;
- and
- a platen configured to support the polishing pad and retaining ring during polishing.
1 more element
Dependencies are inferred from the claim text.