System and method for depositing thin layers on non-planar substrates by stamping
OwnerStephen Forrest, Xin Xu +1inventors
InventorsStephen Forrest, Xin Xu, Marcelo Davanco
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Abstract
An optoelectronic device may be fabricated on a three dimensional surface by transferring a material from an elastomeric stamp to a non-planar substrate. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer. The material may be deposited on the stamp while the stamp is in a planar configuration or after the stamp has been deformed to a shape generally the same as the shape of the non-planar substrate. The material may be transferred by cold welding. The device may include organic layers.
Claims19
A method of fabricating an optoelectronic device comprising:
- coating the surface of an elastomeric stamp with a material to be deposited;
- deforming the elastomeric stamp;
- and transferring the material from the elastomeric stamp to the non-planar substrate.
A method of fabricating an optoelectronic device comprising:
- deforming an elastomeric stamp;
- coating the surface of the deformed elastomeric stamp with a material to be deposited;
- and
- transferring the material from the elastomeric stamp to the non-planar substrate.
A method of fabricating an optoelectronic device comprising:
- coating the surface of an elastomeric stamp with a first metal;
- deforming the elastomeric stamp;
- coating a non-planar substrate with a first metal strike layer;
- transferring the first metal from the elastomeric stamp to the non-planar substrate by cold welding, wherein the first metal forms a first electrode;
- and
- depositing a plurality of organic layers over the non-planar substrate.
Dependencies are inferred from the claim text.