Integrated circuit package system with triple film spacer
AssigneeSTATS ChipPAC, Ltd.
InventorsTaeg Ki Lim, JaEun Yun, Byung Joon Han
Life of this patent
Estimating the term…
Abstract
An integrated circuit package in package system includes: providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires; mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded in the first film; and encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.
Claims20
An integrated circuit package in package system comprising:
- providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires;
- mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded in the first film;
- and
- encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.
An integrated circuit package in package system comprising:
- providing a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires;
- mounting a triple film spacer above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded in the first film;
- mounting a second wire-bonded die with an active side above the triple film spacer and connecting the active side of the second wire-bonded die to the substrate with the bond wires;
- and
- encapsulating the first wire-bonded die, the bond wires, and the triple film spacer with an encapsulation.
An integrated circuit package in package system comprising:
- a substrate with a first wire-bonded die mounted thereover, and connected to the substrate with bond wires;
- a triple film spacer mounted above the first wire-bonded die, the triple film spacer having fillers in a first film and in a third film, and having a second film separating the first film and the third film, and the bond wires connecting the first wire-bonded die to the substrate are embedded in the first film;
- and
- an encapsulation encapsulating the first wire-bonded die, the bond wires, and the triple film spacer.
Dependencies are inferred from the claim text.