Semiconductor device and method for manufacturing the same

A method for manufacturing a semiconductor device, comprising:

• providing on a supporting plate a first semiconductor chip having a pad electrode formed on an upper surface thereof;
• connecting the pad electrode and an upper surface of the supporting plate using a bonding wire;
• forming on the supporting plate a columnar electrode with a part of the bonding wire being embedded therein, and a resin section sealing the first semiconductor chip, the columnar electrode and the remaining part of the bonding wire, and exposing the upper surface of the columnar electrode;
• removing the supporting plate;
• and
• separating the first semiconductor chip by cutting the resin section along the first semiconductor chip.

A method for manufacturing a semiconductor device comprising:

• forming a groove on a semiconductor wafer having a pad electrode formed on an upper surface thereof;
• connecting the pad electrode and a lower surface of the groove by a bonding wire;
• forming on the semiconductor wafer a columnar electrode with a part of the bonding wire being embedded therein, and a resin section sealing the first semiconductor chip, the columnar electrode and the remaining part of the bonding wire, embedding the groove therein, and exposing the upper surface of the columnar electrode;
• forming the first semiconductor chip from the semiconductor wafer by grinding or polishing a lower surface of the semiconductor wafer so as to expose a lower surface of the columnar electrode;
• and
• separating the first semiconductor chip by cutting the resin section along the groove.