Semiconductor apparatus and manufacturing method thereof

A semiconductor apparatus comprising:

• a circuit substrate;
• a plurality of quadrilateral-shaped semiconductor elements stacked on the circuit substrate, each of the semiconductor elements having an electrode terminal, each of the semiconductor elements having a tapered surface formed by cutting off at least an edge of an electrode terminal formation surface, on which the electrode terminal is formed, among edges formed along each of sides of the semiconductor element;
• a side surface wiring which makes an electrical connection between each of electrode terminals of the semiconductor elements and a pad formed on the circuit substrate;
• and
• metal wires, each of which is connected to each of the electrode terminals of the semiconductor elements at its one end and extended along the tapered surface of the each of semiconductor elements,
• wherein at least a part of the metal wire extended from each of the electrode terminals of the semiconductor elements along the tapered surface makes contact with the side surface wiring and is electrically connected to the side surface wiring.