Semiconductor device and method of producing the same
AssigneeOki Electric Industry Co., Ltd.
InventorHidenori Hasegawa
Life of this patent
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Abstract
A semiconductor device includes a package substrate having a front surface and a backside surface; an electrode pad formed on the front surface; an outer connection pad formed on the backside surface and electrically connected to the electrode pad; a semiconductor chip mounted on the front surface and having an electrode electrically connected to the electrode pad; a sealing resin layer having a through hole formed with a die-molding and reaching the electrode pad for sealing the semiconductor chip; and a through electrode filled in the through hole with a conductive material and having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer.
Claims10
A semiconductor device comprising:
- a package substrate having a front surface and a backside surface;
- an electrode pad formed on the front surface;
- an outer connection pad formed on the backside surface and electrically connected to the electrode pad;
- a semiconductor chip mounted on the front surface and having an electrode electrically connected to the electrode pad;
- a sealing resin layer having a through hole formed with a die-molding and reaching the electrode pad for sealing the semiconductor chip;
- and
- a through electrode filled in the through hole with a conductive material and having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer.
A method of producing a semiconductor device, comprising the steps of:
- preparing a substrate frame to be divided into a package substrate;
- forming an electrode pad on a front surface of the package substrate;
- forming an outer connection pad on a backside surface of the package substrate so that the outer connection pad is electrically connected to the electrode pad;
- mounting a semiconductor chip on the front surface so that an electrode of the semiconductor chip is electrically connected to the electrode pad;
- molding a sealing resin layer with a metal die having a protrusion with a column shape contacting with the electrode pad while the metal die is pressed against a surface of the substrate frame so that the sealing resin layer includes a through hole reaching the electrode pad and seals the semiconductor chip;
- filling the through hole with a conductive material to form a through electrode having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer;
- and
- scribing the substrate frame to divide the substrate frame into the package substrate.
A method of producing a semiconductor device, comprising the steps of:
- preparing a substrate frame to be divided into a package substrate;
- forming an electrode pad on a front surface of the package substrate;
- forming an outer connection pad on a backside surface of the package substrate so that the outer connection pad is electrically connected to the electrode pad;
- mounting a semiconductor chip on the front surface so that an electrode of the semiconductor chip is electrically connected to the electrode pad;
- molding a sealing resin layer with a metal die having a protrusion with a column shape contacting with the electrode pad while the metal die is pressed against a surface of the substrate frame so that the sealing resin layer includes a through hole reaching the electrode pad and seals the semiconductor chip;
- filling the through hole with a conductive material to form a through electrode having one end portion electrically connected to the electrode pad and the other end portion exposed from the sealing resin layer;
- forming a re-distribution pad on a surface of the sealing resin layer;
- forming a connection wiring portion on the surface of the sealing resin layer for electrically connecting the other end of the through electrode and the re-distribution pad;
- and
- scribing the substrate frame to divide the substrate frame into the package substrate.
Dependencies are inferred from the claim text.