Back to results
US 2009/0020876 A1Published application
High temperature packaging for semiconductor devices
OwnerThomas A. Hertel, Daniel Taninventors
Life of this patent
Estimating the term…
Abstract
A method of forming multiple bonds on an electronic device includes heating first bonding metals at a predetermined temperature to form a first bond comprising a first melting temperature above the predetermined temperature. The first bond and second bonding metals are then heated at the predetermined temperature to form a second bond comprising a second melting temperature above the predetermined temperature.
Claims17
A method of forming multiple bonds on an electronic device, comprising:
- (a) heating first bonding metals at a predetermined temperature to form a first bond comprising a first melting temperature above the predetermined temperature;
- and
- (b) heating the first bond and second bonding metals at the predetermined temperature to form a second bond comprising a second melting temperature above the predetermined temperature.
An electronic device comprising:
- an electronic component;
- a substrate;
- and
- a plurality of metal layers between the electronic component and the substrate for forming an alloy to bond the electronic component and the substrate together.
1 more element
An electronic device comprising:
- a plurality of electronic components;
- at least one substrate attached to the plurality of electronic components;
- and
- a diffusion bond between each of the plurality of electronic components and the at least one substrate, each diffusion bond comprising an alloy.
1 more element
Dependencies are inferred from the claim text.