Wire bonding method and semiconductor device
AssigneeKabushiki Kaisha Shinkawa
InventorsTatsunari Mii, Hayato Kiuchi
Life of this patent
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Abstract
In order to prevent bonded wires from being damaged during another wire bonding in a semiconductor device, there is provided a wire bonding method for wire-connecting pads on a semiconductor chip and multiple leads corresponding to the pads in a semiconductor device to be manufactured by sealing the semiconductor chip and the leads together in one block, in which bumps and are formed with an ultrasonic vibration on all of the pads on the semiconductor chip and the leads included in the one block, and then wires are provided, with no ultrasonic vibration, for connection between the bumps and on the pads and the leads.
Claims14
A wire bonding method, comprising:
- a first bump forming step of forming first bumps on all pads in a block of at least one semiconductor chip;
- a second bump forming step of forming second bumps on all leads in the block, each of the leads corresponding to one of the pads;
- and
- a wire connecting step of providing wire connections between the bumps and the leads, with no ultrasonic vibration.
A semiconductor device, comprising:
- first bumps formed on a plurality of pads on at least one semiconductor chip in a block;
- second bumps formed on a plurality of leads on the at least one semiconductor chip, each of the leads corresponding to a respective pad and being in the block;
- and
- wires provided for connection between the first and second bumps without ultrasonic vibration being applied to the block after the first and second bumps are formed.
Dependencies are inferred from the claim text.