Electronic device provided with wiring board, method for manufacturing such electronic device and wiring board for such electronic device
OwnerShinji Watanabe, Yukio Yamagutiinventors
Life of this patent
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Abstract
An electronic device (1) is provided with a wiring board (2) and a semiconductor chip (5). The wiring board (2) is provided with a first resin layer (3a) and a second resin layer (3b) stacked one over another by having a wiring (4) in between. The semiconductor chip (5) has bumps (6) on one side and is connected with the wiring (4) by entering into the first resin layer (3a) to bring the bumps (6) into contact with the wiring (4). The first resin layer (3a) includes a thermoplastic resin, and the second resin layer (3b) has an elasticity of 1 GPa or higher at a melting point of the first resin layer (3a).
Claims40
An electronic device comprising:
- a wiring board including a first resin layer and a second resin layer which are stacked one on the other with interconnections interposed therebetween;
- and
- at least one chip component having protrusive electrodes disposed on one surface thereof;
- said chip component being displaced into said first resin layer and connected to said interconnections with said protrusive electrodes being held in contact with said interconnections;
- said first resin layer containing at least one thermoplastic resin, and said second resin layer having an elastic modulus of 1 GPa or higher at the melting point of said first resin layer.
A method of manufacturing an electronic device having a chip component mounted on a wiring board, comprising the steps of:
- preparing a chip component with protrusive electrodes disposed on one surface thereof and a wiring board including a first resin layer and a second resin layer which are stacked one on the other with interconnections interposed therebetween, said first resin layer containing at least one thermoplastic resin, and said second resin layer having an elastic modulus of 1 GPa or higher at the melting point of said first resin layer;
- heating a region of said first resin layer in which said chip component is mounted at a temperature equal to or higher than the melting point of said first resin layer;
- pressing said chip component into said first resin layer in the heated region of said first resin layer while the surface with the protrusive electrodes faces said first resin layer;
- bringing the protrusive electrode of said chip component into contact with said interconnections by piercing said first resin layer;
- and
- holding said protrusive electrodes and said interconnections in contact with each other until said first resin layer is cured.
A wiring board for mounting thereon at least one chip component with protrusive electrodes disposed on one surface thereof, comprising:
- a first resin layer;
- a second resin layer stacked on said first resin layer with interconnections interposed therebetween, said protrusive electrodes of the chip component displaced into said first resin layer being held in contact with said interconnections;
- said first resin layer containing at least one thermoplastic resin, and said second resin layer having an elastic modulus of 1 GPa or higher at the melting point of said first resin layer.
Dependencies are inferred from the claim text.