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US 2009/0020869 A1Published application
Interconnect joint
OwnerQing Xue, Shengquan E. Ou +1inventors
InventorsQing Xue, Shengquan E. Ou, Sairam Agraharam
Life of this patent
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Abstract
An interconnect joint comprises a substrate (110), a solder resist layer (120) over the substrate, a solder resist opening (130) (having a top surface (131)) in the solder resist layer, a solder material (140) in the solder resist opening, and an electrically conducting structure (150) having a portion that extends into the solder material below the top of the solder resist opening.
Claims14
An interconnect joint comprising:
- a substrate;
- a solder resist layer over the substrate;
- a solder resist opening in the solder resist layer, the solder resist opening having a top;
- a solder material in the solder resist opening;
- and
- an electrically conducting structure having a portion that extends into the solder material below the top of the solder resist opening.
3 more elements
An interconnect joint comprising:
- a substrate;
- a solder resist layer over the substrate;
- a solder resist opening in the solder resist layer, the solder resist opening having a top and a floor,
- a copper pad on the floor of the solder resist opening;
- a solder material in the solder resist opening over the copper pad;
- and
- a copper bump arranged over the copper pad such that a portion of the solder material in the solder resist opening is in a state that is approximately equal to hydrostatic equilibrium.
4 more elements
Dependencies are inferred from the claim text.