Wafer Level package Structure and Fabrication Methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHan-Ping Pu, Mirng-Ji Lii
Life of this patent
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Abstract
A method of forming a package structure with reduced damage to semiconductor dies is provided. The method includes providing a die comprising bond pads on a top surface of the die; forming bumps on the bond pads of the die, wherein the bumps have top surfaces higher than the top surface of the die; mounting the die on a chip carrier, wherein the bumps are attached to the chip carrier; molding the die onto the chip carrier with a molding compound; de-mounting the chip carrier from the die; and forming redistribution traces over, and electrically connected to, the bumps of the die.
Claims25
A method of forming a package structure, the method comprising:
- providing a die comprising bond pads on a top surface of the die;
- forming bumps on the bond pads of the die, wherein the bumps have top surfaces higher than the top surface of the die;
- mounting the die on a chip carrier, wherein the bumps are attached to the chip carrier;
- molding the die onto the chip carrier with a molding compound;
- de-mounting the chip carrier from the die;
- and
- forming redistribution traces over, and electrically connected to, the bumps of the die.
A method of forming a package structure, the method comprising:
- providing a plurality of dies, each comprising copper bumps having top surfaces higher than top surfaces of the respective dies;
- providing a chip carrier comprising a plurality of regions, each of the plurality of regions including a plurality of pads laid out as a mirror of the copper bumps on one of the plurality of dies;
- placing the plurality of dies on the chip carrier, each in one of the plurality of the regions of the chip carrier, wherein the copper bumps are aligned to the pads with solder therebetween;
- reflowing the solder balls so that the plurality of dies are attached to the chip carrier;
- molding the plurality of dies onto the chip carrier using a molding compound to form a plurality of packages, each comprising one of the dies, wherein the molding compound fills gaps between the copper bumps and gaps between the plurality of dies;
- de-mounting the chip carrier from the plurality of dies and the molding compound;
- forming redistribution traces over, and electrically connected to, the copper bumps;
- and
- sawing the plurality of packages.
A package structure comprising:
- a semiconductor die;
- bonding pads on a top surface of the semiconductor die;
- bumps on the bond pads, wherein the bumps have top surfaces higher than the top surface of the die;
- a molding compound encircling the die, wherein the molding compound fills into gaps between the bumps;
- vias over and electrically connected to the bumps;
- and
- redistribution traces over and electrically connected to the bumps.
Dependencies are inferred from the claim text.