Stacked semiconductor devices and signal distribution methods thereof
AssigneeSamsung Electronics Co., Ltd.
InventorYoung-Don Choi
Life of this patent
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Abstract
A stacked semiconductor device includes a plurality of stacked chips, each having a plurality of elements to receive a signal. At least one first ladder main signal line for receiving the signal is arranged to pass through the chips. At least one second ladder main signal line is arranged to pass through the chips. A plurality of ladder buffers buffer the signal applied from the first ladder main signal line to the second ladder main signal line. The signal is uniformly distributed to the stacked chips using a ladder type circuit network technique.
Claims20
A stacked semiconductor device comprising:
- a plurality of stacked chips each having a plurality of elements, configured to receive a signal and perform an operation;
- at least one first ladder main signal line arranged to pass through the plurality of chips and configured to receive the signal;
- at least one second ladder main signal line arranged to pass through the plurality of chips;
- and
- a plurality of ladder buffers disposed between the at least one first ladder main signal line and the at least one second ladder main signal line, wherein
- the plurality of ladder buffers are configured to buffer the signal from the at least one first ladder main signal line to the at least one second ladder main signal line.
A signal distribution method of a stacked semiconductor device including a plurality of stacked chips each having a plurality of elements, configured to receive and perform an operation, comprising:
- receiving the signal at an at least one first ladder main signal line, the at least one first ladder main signal line passing through the plurality of stacked chips;
- and
- buffering the signal through a plurality of ladder buffers from the first ladder main signal line to an at least one second ladder main signal line, the at least one second ladder main signal line passing through the plurality of stacked chips.
Dependencies are inferred from the claim text.