Semiconductor device and manufacturing method of the same

A semiconductor device comprising:

• a chip mounting portion;
• a plurality of suspending leads integral with the chip mounting portion and each having a slit;
• a semiconductor chip having a main surface with a plurality of electrodes formed therein and mounted over the chip mounting portion;
• a plurality of inner leads arranged around the semiconductor chip;
• a plurality of common leads integral with the suspending leads and positioned respectively between the chip mounting portion and the inner leads;
• a plurality of first wires for coupling the electrodes of the semiconductor chip and the inner leads electrically with each other;
• a plurality of second wires for coupling the electrodes of the semiconductor chip and the common leads electrically with each other;
• a sealing body for sealing the semiconductor chip, the chip mounting portion, the first wires and the second wires;
• and
• a plurality of outer leads integral with the inner leads respectively and exposed from the sealing body.

A method for manufacturing a semiconductor device, comprising the steps of:

• (a) providing a lead frame comprising:
• a chip mounting portion;
• a plurality of suspending leads integral with the chip mounting portion and each having a slit;
• a plurality of leads arranged around the chip mounting portion;
• and a plurality of common leads integral with the suspending leads and positioned between the chip mounting portion and the leads;
• (b) mounting a semiconductor chip over the chip mounting portion, wherein the semiconductor chip has a main surface with a plurality of electrodes formed therein;
• (c) coupling the electrodes of the semiconductor chip and the common leads electrically with each other through a plurality of wires for the common leads;
• (d) coupling the electrodes of the semiconductor chip and the leads electrically with each other through a plurality of wires for the leads;
• and
• (e) sealing the semiconductor chip, the chip mounting portion, the wires for the common leads and the wires for the leads with resin.

A semiconductor device comprising:

• a chip mounting portion;
• a plurality of suspending leads integral with the chip mounting portion;
• a semiconductor chip mounted over the chip mounting portion and having a main portion with a plurality of electrodes formed therein;
• a plurality of inner leads arranged around the semiconductor chip;
• a plurality of common leads integral with the suspending leads and positioned between the chip mounting portion and the inner leads, respectively;
• a plurality of first wires for coupling the electrodes of the semiconductor chip and the inner leads electrically with each other;
• a plurality of second wires for coupling the electrodes of the semiconductor chip and the common leads electrically with each other;
• a sealing body for sealing the semiconductor chip, the chip mounting portion, the first wires and the second wires;
• and
• a plurality of outer leads integral with the inner leads respectively and exposed from the sealing body,
• wherein some of the inner leads are coupled to the common leads.