System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (sip) devices
AssigneeMarvell International Technology Ltd.
InventorsMichael David Cusack, Randall Don Briggs
Life of this patent
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Abstract
An integrated circuit or chip includes a first die and a second die positioned on a lead frame of a package including a lead frame, such as a QFP, DIP, PLCC, TSOP, or any other type of package including a lead frame. The integrated circuit further includes a redistribution layer formed on the first die to couple selected bond fingers of the lead frame to selected bonding pads of the first and second die. The selected bond fingers may correspond to bond fingers that receive a first supply voltage or the first supply voltage and a second supply voltage.
Claims5
A method of routing signals from bond fingers of lead frame contained in a package to die positioned on a die paddle of the lead frame, the method comprising:
- routing a signal from one of the bond fingers to a first node on a first die;
- routing the signal from the first node to a second node on the first die;
- routing the signal from the second node to a third node contained on the first die to thereby provide the signal to the first die;
- and
- routing the signal from the second node to a fourth node contained on a second die to thereby provide the signal to the second die.
Dependencies are inferred from the claim text.