Semiconductor device structures and methods for shielding a bond pad from electrical noise
AssigneeInternational Business Machines Corporation
InventorsDavid S. Collins, Mete Erturk, Edward J. Gordon, Robert Groves, Robert M. Rassel
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Abstract
Semiconductor device structures and methods for shielding a bond pad from electrical noise generated by active circuitry of an integrated circuit carried on a substrate. The structure includes electrically characterized devices placed in a pre-determined arrangement under the bond pad. The pre-determined arrangement of the electrically characterized devices provides for a consistent high frequency environment under the bond pad, which simplifies modeling of the bond pad by a circuit designer.
Claims13
A semiconductor device structure comprising:
- a substrate;
- active circuitry on the substrate;
- a bond pad carried by the substrate;
- and
- a shielding structure disposed between the substrate and the bond pad, the shielding structure including a plurality of electrically characterized devices configured to reduce noise transmission from the active circuitry to the bond pad.
A method of reducing noise transmission from active circuitry on a substrate to an overlying bond pad, the method comprising:
- fabricating a shielding structure including a plurality of electrically characterized devices disposed between the substrate and the bond pad to provide a ground plane;
- and
- selectively activating one or more of the plurality of electrically characterized devices in the shielding structure.
Dependencies are inferred from the claim text.