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US 2009/0020779 A1Published application
Method of preparing a sealed light-emitting diode chip
AssigneeNamics Corporation
InventorsToshiaki Yamada, Masaki Yoshida, Satoko Takahashi
Life of this patent
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Abstract
A method for producing a light emitting diode chip encapsulation product, the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film.
Claims20
A method for producing a light emitting diode chip encapsulation product,
- the method comprising covering a light emitting diode chip connected onto a substrate with a thermosetting film, and thermally curing the thermosetting film.
Dependencies are inferred from the claim text.