Package of light emitting diode and method for manufacturing the same
AssigneeLG Innotek Co., Ltd.
InventorBo Geun Park
Life of this patent
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Abstract
Provided is a package of a light emitting diode. The package includes a metal plate, a light-emitting diode chip, an insulating layer, a lead frame, a reflective coating layer, and a molding material. The light-emitting diode chip is surface-mounted on the metal plate, and the insulating layer is formed on the metal plate and is separated from the light-emitting diode chip. The lead frame is provided on the insulating layer, the reflective coating layer is formed on the lead frame, and the molding material molds the light-emitting diode chip in a predetermined shape.
Claims18
A package of a light emitting diode comprising:
- a metal plate;
- a light-emitting diode chip surface-mounted on the metal plate;
- an insulating layer on the metal plate, the insulating layer being separated from
- the light-emitting diode chip;
- a lead frame on the insulating layer;
- a reflective coating layer on the lead frame;
- and
- a molding material molding the light-emitting diode chip in a predetermined shape.
A method for manufacturing a package of a light-emitting diode, the method comprising:
- forming an insulating layer under a lead frame;
- forming a light-emitting diode mounting region in the lead frame and the insulating layer;
- forming a metal plate under the insulating layer in which the light-emitting diode mounting region is formed;
- forming a reflective coating layer on the lead frame;
- surface-mounting a light-emitting diode chip on the metal plate in the mounting region;
- and
- performing molding on the light-emitting diode chip.
Dependencies are inferred from the claim text.