Si/sige interband tunneling diodes with tensile strain
AssigneeThe Ohio State University Research Foundation
InventorsNiu JIN, Paul R. Berger, Phillip E. Thompson
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AssigneeThe Ohio State University Research Foundation
InventorsNiu JIN, Paul R. Berger, Phillip E. Thompson
Estimating the term…
Some disclosed interband tunneling diodes comprise a plurality of substantially coherently strained layers including layers selected from a group consisting of silicon, germanium, and alloys of silicon and germanium, wherein at least one of said substantially coherently strained layers is tensile strained. Some disclosed resonant interband tunneling diodes comprise a plurality of substantially coherently strained layers including layers selected from a group consisting of silicon, germanium, and alloys of silicon and germanium, wherein at least one of said substantially coherently strained layers defines a barrier to non-resonant tunnel current. Some disclosed interband tunneling diodes comprise a plurality of substantially coherently strained layers, wherein at least one of said substantially coherently strained layers is tensile strained. Some disclosed resonant interband tunneling diodes comprise a plurality of substantially coherently strained layers, wherein at least one of said substantially coherently strained layers defines a barrier to non-resonant tunnel current.
A device comprising:
A device comprising:
A method for fabricating an interband tunneling junction, the method comprising:
Dependencies are inferred from the claim text.