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US 2009/0020712 A1Published application
Plating processing method, light transmitting conductive film and electromagnetic wave shielding film
AssigneeFUJIFILM Corporation
InventorJun Matsumoto
Life of this patent
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Abstract
A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 Ωf/Sq to 1000 Ω/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.
Claims11
A plating processing method, which comprises performing a continuous electrolytic plating of a surface of a film having a surface resistivity in a range of 1 Ω/Sq to 1000 Ω/Sq,
- wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in a range of 0.5 cm to 15 cm.
Dependencies are inferred from the claim text.