Method and Apparatus for Manufacturing Solder Mounting Structure
AssigneeSharp Kabushiki Kaisha
InventorsKazuo Kinoshita, Katsuitsu Nishida
Life of this patent
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Abstract
In manufacturing a camera module structure (100), a hot air nozzle (4) melts solder at a solder connection portion (3) by blowing hot air to the solder connection portion (3), while a suction nozzle (5) suctions the hot air that moves toward the camera module (2), from a position nearer from the camera module (2) than a position of the hot air nozzle (4). This makes it possible to manufacture a solder mounting structure in which a heat-vulnerable electronic component can be mounted on a wiring board without being damaged by heat.
Claims27
A method for manufacturing a solder mounting structure, comprising:
- mounting an electronic component on a wiring board via a solder connection portion, wherein:
- in the step of mounting, a blow of hot air melts solder at the solder connection portion while the hot air moving toward the electronic component is suctioned from a position nearer from the electronic component than a hot air blowing position.
A method for manufacturing a solder mounting structure, comprising:
- mounting an electronic component on a wiring board via a solder connection portion, wherein:
- in the step of mounting, a blow of hot air melts solder at the solder connection, while the hot air moving toward the electronic component, and atmosphere in a vicinity of the electronic component are suctioned together from a position nearer from the electronic component than a hot air blowing position.
An apparatus for manufacturing a solder mounting structure in which an electronic component is mounted on a wiring board via a solder connection portion, comprising:
- a hot air nozzle configured to blow hot air to the solder connection portion;
- and
- a suction nozzle configured to suction the hot air,
- the hot air nozzle melting solder at the solder connection portion by blowing the hot air to the solder connection portion, while the suction nozzle suctions the hot air moving toward the electronic component, from a position nearer from the electronic component than a hot air blowing position.
An apparatus for manufacturing a solder mounting structure in which an electronic component is mounted on a wiring board via a solder connection portion, comprising:
- a hot air nozzle configured to blow hot air to the solder connection portion;
- and
- a suction nozzle configured to suction the hot air,
- the hot air nozzle melting solder at the solder connection portion by blowing the hot air to the solder connection portion, while the suction nozzle suctions the hot air moving toward the electronic component, and atmosphere in a vicinity of the electronic component concomitantly, from a position nearer from the electronic component than a hot air blowing position.
Dependencies are inferred from the claim text.