Method for manufacturing product involving solder joining, solder joining apparatus, soldering condition verification method, reflow apparatus, and solder joining method

A soldering condition verification method for verifying suitability of soldering conditions for component mounting on a board, comprising:

• calculating a volume for components placed within a given area on said board;
• extracting a maximum component volume from said calculated component volume;
• determining the lowest reflow temperature on said board by using said extracted maximum component volume as a parameter;
• and
• verifying the suitability of soldering conditions for said board by comparing said lowest reflow temperature with a temperature required for soldering.

A reflow apparatus for performing reflow soldering by heating a board on which components are mounted, comprising:

• a heating mechanism which heats said components;
• a control unit which controls said heating mechanism;
• and
• a storage unit which stores reflow conditions which said control unit uses when controlling said heating mechanism, and wherein
• said reflow conditions are set in accordance with the volume of components mounted within a given area on said board, and
• said control unit reads out from said
• storage unit said reflow conditions stored for said board to be subjected to reflow soldering, and controls said reflow soldering on said board by using said readout reflow conditions.