Method of forming passage through substrate for mems module
AssigneeLingsen Precision Industries, Ltd.
InventorsChiung-Yueh TIEN, Hsi-Chen Yang
Life of this patent
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Abstract
A method of forming a passage through a substrate for a MEMS module is disclosed to include the steps of: a) etching a substrate having a thickness smaller than 0.30 mm to form a bottom recess; b) etching a top side of the substrate to form a top recess to define a part of the substrate as a sacrifice portion; c) forming a bottom layer in the bottom recess of the substrate by injection molding; d) depositing a support layer in the top recess of the substrate; and e) removing the sacrifice portion from the substrate by etching to form a passage defined between the support layer and the bottom layer in the substrate with two ends in communication with ambient atmosphere.
Claims8
A method of forming a passage through a substrate for a MEMS module, comprising the steps of:
- a) etching a substrate having a thickness smaller than 0.30 mm to form a bottom recess at a bottom side of the substrate;
- b) etching a top side of the substrate to form a top recess to define a part of the substrate as a sacrifice portion between the top recess and the bottom recess;
- c) forming a bottom layer in the bottom recess of the substrate by injection molding;
- d) depositing a support layer in the top recess of the substrate;
- and
- e) removing the sacrifice portion from the substrate by etching to form a passage defined between the support layer and the bottom layer in the substrate with two ends in communication with ambient atmosphere.
A method of forming a passage through a substrate for a MEMS module, comprising the steps of:
- a) etching a substrate having a thickness smaller than 0.30 mm to form a top recess having a first portion disposed at a top side of the substrate and a second portion penetrating the substrate and communicating with the first portion;
- b) placing a sacrifice member in the first portion of the top recess of the substrate;
- c) depositing a support layer on the top side of the substrate to partially cover the sacrifice member;
- and
- d) removing the sacrifice member by etching such that the space left by removal of the sacrifice member and the second portion of the top recess form a passage surrounded by the support layer and the substrate with two ends in communication with ambient atmosphere.
Dependencies are inferred from the claim text.