Method and system for controlled material removal by electrochemical polishing
OwnerBulent M. Basol, Cyprian E. Uzoh +1inventors
InventorsBulent M. Basol, Cyprian E. Uzoh, George Xinsheng Guo
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Abstract
A method and apparatus for electropolishing a conductive layer on a wafer is provided. The apparatus includes an electrode and a conductive member having openings permitting an electropolishing solution to flow through it. Surface of the conductive member includes a surface profile. During the electropolishing process, the surface of the conductive element is placed across from the conductive layer and a potential difference is applied between the conductive layer and the electrode. The process forms a conductive layer profile of the conductive layer.
Claims29
An apparatus for electropolishing a conductive layer on a workpiece using a process solution, comprising:
- a carrier to hold the workpiece;
- an electrode;
- and
- a conductive element placed between the electrode and the conductive layer, the conductive element having openings permitting process solution to flow through the conductive element and the conductive element having a surface placed across from the conductive layer, the surface of the conductive element including a surface profile to control the material removal profile of the conductive layer.
A method of electropolishing a conductive layer on a wafer using a process solution and an electrode, the method comprising:
- placing a surface of a conductive element across from the conductive layer, the surface of the conductive element having a first surface profile;
- and
- applying a potential difference between the conductive layer and the electrode;
- and
- forming a first conductive layer profile of the conductive layer.
An apparatus for electropolishing a conductive layer on a workpiece using a process solution, comprising:
- a carrier to hold the workpiece;
- an electrode;
- and
- a conductive element placed between the electrode and the conductive layer, the conductive element having openings permitting process solution to flow through the conductive element and the conductive element having a surface placed across from the conductive layer;
- and
- wherein the conductive element is comprised of movable sections to alter the profile of the surface by moving the movable sections to control the material removal profile of the conductive layer.
A method of electropolishing a conductive layer on a wafer using a process solution and an electrode, the method comprising:
- placing a surface of a conductive member across from the conductive layer, the conductive element having openings permitting process solution to flow through the conductive element and the conductive element comprising movable sections;
- changing the profile of the surface of the conductive member to a predetermined profile by moving the movable sections;
- applying a potential difference between the conductive layer and the electrode;
- and
- forming a predetermined conductive layer profile of the conductive layer.
Dependencies are inferred from the claim text.