Wiring unit, method for producing wiring unit, liquid jetting apparatus, and method for producing liquid jetting apparatus

A method for producing a wiring unit, comprising:

• forming a stacked body which has a first insulating layer having an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer, a second insulating layer stacked on the one surface of the first insulating layer, an adhesive layer formed on a surface, of the second insulating layer, not facing the first insulating layer, a through hole formed through the adhesive layer and the second insulating layer and in which the electrode is exposed;
• injecting a liquid electroconductive material into a recess defined by the through hole and the electrode exposed in the through hole;
• and
• attaching a detachable protective sheet on the adhesive layer so that the protective sheet covers the through hole to enclose the liquid electroconductive material in the wiring unit.

A liquid jetting apparatus comprising:

• a jetting port through which a liquid is jetted;
• a liquid channel which is connected to the jetting port, and through which the liquid to be jetted from the jetting port flows;
• a pressure chamber which is formed in the liquid channel;
• a piezoelectric layer which covers the pressure chamber and which is deformed to change a volume of the pressure chamber when a voltage is applied to the piezoelectric layer;
• and
• a wiring unit having an electrode which is electrically connected to the piezoelectric layer and which applies the voltage,
• wherein the wiring unit includes a first insulating layer provided with an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer, a second insulating layer which is formed on the one surface of the first insulating layer and which covers the wire, an adhesive layer which is formed on a surface of the second insulating layer not facing the first insulating layer, a through hole which is formed through the adhesive layer and the second insulating layer and in which the electrode is exposed;
• a liquid electroconductive material is accommodated in a recess which is defined by the through hole and the electrode exposed in the through hole;
• and
• the wiring unit is connected via the adhesive layer to a surface of the piezoelectric layer not facing the pressure chamber, and the electrode and the piezoelectric layer are electrically connected to each other via the liquid electroconductive material.

A method for producing a liquid jetting apparatus having a jetting port which jets a liquid, a liquid channel which is connected to the jetting port and through which the liquid to be jetted from the jetting port flows, and a pressure chamber which is formed in the liquid channel, the method comprising:

• providing a piezoelectric layer, which is deformed when a voltage is applied to the piezoelectric layer, such that one surface of the piezoelectric layer faces the pressure chamber;
• providing a wiring unit including a first insulating layer which is provided with an electrode and a wire electrically connected to the electrode on one surface of the first insulating layer, a second insulating layer which is formed on the one surface of the first insulating layer and which covers the wire, an adhesive layer which is formed on a surface of the second insulating layer not facing the first insulating layer, a through hole which is formed through the adhesive layer and the second insulating layer and in which the electrode is exposed, and a protective sheet which is detachably adhered on a surface of the adhesive layer not facing the second insulating layer, a liquid electroconductive material being filled in a space defined by the through hole, and the electrode being exposed in the through hole, and the protective sheet;
• peeling the protective sheet off from the wiring unit;
• and
• attaching the channel unit, from which the protective sheet has been peeled off, to the other surface of the piezoelectric layer via the adhesive layer such that an area of the piezoelectric layer corresponding to the pressure chamber and the through hole of the wiring unit are overlapped with each other in a thickness direction of the piezoelectric layer to electrically connect the electrode and the piezoelectric layer via the liquid electroconductive material.