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US 2009/0020325 A1Published application
Weldable contact and method for the production thereof
AssigneeEpcos AG
InventorsRobert Hammedinger, Konrad Kastner, Martin Maier, Michael Obesser
Life of this patent
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Abstract
A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
Claims20
A solderable contact for use with an electrical component, the solderable contact comprising:
- a pad metallization on a substrate;
- an under bump metallization over at least part of the pad metallization, the under bump metallization being in an area for receiving solder,
- wherein the pad metallization is structured to reveal parts of the substrate surface, the under bump metallization being in direct contact with the pails of the substrate.
A method for manufacturing a solderable contact, comprising:
- structuring a lift-off layer on a substrate to form a structured lift-off layer, the structured lift-off layer forming an inverse shape of a metallization structure, comprising at least one connection surface pad;
- applying, over the lift-off layer and substrate, layers for a pad metallization;
- removing the structured lift-off layer and layers for the pad metallization that are over the structured lift-off layer;
- applying an additional lift-off layer;
- structuring the additional lift-off layer to form an inverse mold of under bump metallization;
- and
- applying a metal layer over the additional lift-off layer;
- removing the additional lift-off layer;
- wherein structuring of the first lift-off layer occurs in area of the under bump metallization in a pattern that has alternating recesses and elevations.
6 more elements
Dependencies are inferred from the claim text.