Packaging substrate with conductive structure
AssigneePhoenix Precision Technology Corporation
InventorShih-Ping Hsu
Life of this patent
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Abstract
A packaging substrate with conductive structure is provided, including a substrate body having at least one conductive pad on a surface thereof, a stress buffer metal layer disposed on the conductive pad, a solder resist layer disposed on the substrate body and having at least one opening therein for correspondingly exposing a portion of top surface of the stress buffer metal layer, a metal post disposed on a central portion of the surface of the stress buffer metal layer, and a solder bump covering the surfaces of the metal post. Therefore, a highly reliable conductive structure is provided, by using the stress buffer metal layer to release thermal stresses, and using the metal post and the solder bump to increase the height of the conductive structure.
Claims19
A packaging substrate with conductive structure, comprising:
- a substrate body having at least one conductive pad on a surface thereof;
- a stress buffer metal layer disposed on the conductive pad;
- a solder resist layer disposed on the substrate body and having at least one opening therein corresponding in position to the stress buffer metal layer, with a size of the opening smaller than that of the stress buffer metal layer;
- a metal post disposed on a central portion of the stress buffer metal layer;
- and
- a solder bump covering the metal post.
A packaging substrate with conductive structure, comprising:
- a substrate body having at least one conductive pad on a surface thereof;
- a stress buffer metal layer disposed on the conductive pad;
- a solder resist layer disposed on the substrate body and having at least one opening therein corresponding in position to the stress buffer metal layer, with a size of the opening bigger than that of the stress buffer metal layer;
- a metal post disposed on a central portion of the stress buffer metal layer;
- and
- a solder bump covering the metal post.
Dependencies are inferred from the claim text.